Specifications
| Component for |
PC |
| Cooler included |
N |
| Processor operating modes |
64-bit |
| Processor boost frequency |
4.5 |
| Box |
Y |
| Processor lithography |
14 |
| Processor family |
Intel Core i9 X-series |
| Processor frequency |
3.7 |
| Processor cores |
10 |
| Processor socket |
LGA 2066 |
| Processor threads |
20 |
| Processor cache |
19.25 |
| Processor codename |
Cascade Lake |
| Generation |
10th Generation |
| Processor model |
i9-10900X |
| Processor ARK ID |
198019 |
Memory
| Memory channels |
Quad |
| Memory types supported by processor |
DDR4-SDRAM |
| Memory clock speeds supported by processor |
2933 |
| Maximum internal memory supported by processor |
256 |
| ECC |
N |
Graphics
| On-board graphics adapter |
N |
| Discrete graphics adapter |
N |
| On-board graphics adapter model |
Not available |
| Discrete graphics adapter model |
Not available |
Technical details
| Status |
Launched |
| Product type |
Processor |
| Launch date |
Q4’19 |
| Maximum memory |
256 |
Power
| Thermal Design Power (TDP) |
165 |
Features
| PCI Express slots version |
3.0 |
| Harmonized System (HS) code |
8542310001 |
| Execute Disable Bit |
Y |
| Maximum number of PCI Express lanes |
48 |
| Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0,AVX-512 |
| Scalability |
1S |
| CPU configuration (max) |
1 |
| Embedded options available |
N |
| PCI Express CEM revision |
3.0 |
| Thermal solution specification |
PCG 2017X |
Processor special features
| Intel® Hyper Threading Technology (Intel® HT Technology) |
Y |
| Intel® Turbo Boost Technology |
2.0 |
| Intel® AES New Instructions (Intel® AES-NI) |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel 64 |
Y |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
| Intel® Optane™ Memory Ready |
Y |
| Intel Turbo Boost Max Technology 3.0 |
Y |
| AVX-512 Fused Multiply-Add (FMA) units |
2 |
| Intel® Deep Learning Boost (Intel® DL Boost) |
Y |
| Intel® Deep Learning Boost |
Y |
Operational conditions
